Multiple substrate electrical circuit device

Details Multiple substrate electrical circuit device Multiple substrate electrical circuit device

2007-08-27

2010-11-02

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C257S275000

Reexamination Certificate

active

07825005

ABSTRACT:
In one embodiment of the disclosure, a method includes providing a carrier substrate, forming a first region over an upper surface of the substrate, creating an electrical component using a planar process, embedding the electrical component in the dielectric layer, and removing a substrate portion of the electrical component. The first region includes a dielectric layer and may be made of any material that electrically isolates the electrical component from the carrier substrate. The electrical component may be created using a planar process thereby having an epitaxial surface that is embedded in the dielectric layer.

REFERENCES:
patent: 6195047 (2001-02-01), Richards

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