Diffusion patterned C4 bump pads
Diffusion-joined target assemly of high-purity cobalt target...
Dip soldering apparatus and method
Direct application of pressure for bonding porous coatings...
Direct application of unpackaged integrated circuit to flexible
Direct bonding of copper composites to ceramics
Direct bonding of metals to ceramics and metals
Direct brazing of refractory metal features
Direct chip attachment process and apparatus for aluminum wirebo
Direct chip attachment structure and method
Direct die attach utilizing heated bond head
Direct liquid phase bonding of ceramics to metals
Direct metal bonding
Direct metal brazing to cermet feedthroughs
Direct solder bumping of hard to solder substrate
Direct-placement fluxless soldering using inert gas environment
Directionally solidified article with weld repair
Discharge abnormality detection device and method for use in wir
Dispensing solder for mounting semiconductor chips
Dissimilar metal joining method