Direct die attach utilizing heated bond head

Details Direct die attach utilizing heated bond head Direct die attach utilizing heated bond head

2008-10-27

2010-12-21

Ward, Jessica L (Department: 1735)

Metal fusion bonding

Process

Plural joints

C228S180220, C228S214000, C228S215000

Reexamination Certificate

active

07854365

ABSTRACT:
A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature T1so as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards T2and solidifies.

REFERENCES:
patent: 6131795 (2000-10-01), Sato
patent: 6386429 (2002-05-01), Sani-Bakhtiari et al.
patent: 6585853 (2003-07-01), Kitaguchi
patent: 7632710 (2009-12-01), Sakai et al.
patent: 2005/0098610 (2005-05-01), Onobori et al.
patent: 2006/0076388 (2006-04-01), Sato
patent: 2009/0155958 (2009-06-01), Kolodin et al.
patent: 05055635 (1993-03-01), None
patent: WO 2007055410 (2007-05-01), None
English computer translation of JP 05-055635.
Dictionary.com; Random House Dictionary; “Blow”.

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