Discharge abnormality detection device and method for use in wir

Details Discharge abnormality detection device and method for use in wir Discharge abnormality detection device and method for use in wir

1998-02-24

1999-11-23

Ryan, Patrick

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228 565, 219 5621, 219 5622, H01L 2160

Patent

active

059884827

ABSTRACT:
A device and method is available for detecting abnormalities of an electric discharge generated for forming a ball at the end of a bonding wire in a bonding apparatus. A high voltage is applied across the bonding wire and an electrode, and the maximum value of the applied high voltage is detected and sent, via a peak hold circuit, to a computer that compares the maximum high voltage with an insulation breakdown voltage of a normal detection range and calculates a gap between the end of the bonding wire and the electrode, thus determining the discharge abnormalities based upon the result of the calculation of the gap.

REFERENCES:
patent: 4687897 (1987-08-01), McKiel, Jr.
patent: 5463197 (1995-10-01), Miyazaki
patent: 5763849 (1998-06-01), Nakao

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