Direct chip attachment structure and method

Details Direct chip attachment structure and method Direct chip attachment structure and method

1993-06-28

1995-08-08

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228207, 228254, H05K 334

Patent

active

054391628

ABSTRACT:
An integrated circuit (70) is soldered to a printed circuit board (200) by first depositing flux (116) on bumps (75) of the integrated circuit. Solder (214) is deposited upon the bumps (75), and the integrated circuits is (70) placed in contact with pads (210) on the printed circuit board (200). After reflow, a solder joint (230) electrically and mechanically attaches the integrated circuit (70) to the printed circuit board (200).
Alternatively, the solder tipped (214) bumps (75) may be placed in contact with a non-adhering flat plane (300) such as glass during the heating process. After reflow, each bump has a flat portion (350), and the flat portions of all the bumps form a plane (400) which further facilitates attaching the integrated circuit (70) to the printed circuit board (200).

REFERENCES:
patent: 3960279 (1976-06-01), Hartleroad et al.
patent: 4893403 (1990-01-01), Heflinger et al.
Payne, FPT--A Step In The Right Direction, Circuits Assembly, Feb. 1993, 59-64.
Curtin, Solder Paste Printing--The Micro-Mechanics, Circuits Assembly, Aug. 1992, 42-44.
Heimsch, UFP Printing--Ultrafine-Pitch Solder Paste Printing, Circuits Assembly, Jan. 1992, 32-37.

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