Dip soldering apparatus and method

Details Dip soldering apparatus and method Dip soldering apparatus and method

1983-08-08

1985-05-21

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228 36, 228 37, 228214, B23K 300, B23K 108, H01R 4302

Patent

active

045181144

ABSTRACT:
Method and apparatus for forming an electrical contact between mounting pins extending from an electrical component and insulated wires from the component that are wrapped around the pins in which the tips of the pins are held in a flowing pool of molten solder until the heat travelling up the pins loosens the insulation up to a desired level, and the pins are then quickly immersed up to that level and then quickly removed so as to cause the solder to melt and carry away the loosened insulation but to leave substantially intact the insulation that is not loosened.

REFERENCES:
patent: 2619063 (1952-11-01), Anderson
patent: 3765591 (1973-10-01), Cook
patent: 4047655 (1977-09-01), McCafferty
patent: 4113165 (1978-09-01), Ott

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