Direct chip attachment process and apparatus for aluminum wirebo

Details Direct chip attachment process and apparatus for aluminum wirebo Direct chip attachment process and apparatus for aluminum wirebo

1995-10-12

1997-05-27

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228207, 228 45, H01L 21603

Patent

active

056324383

ABSTRACT:
A direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization are provided. After at least one integrated circuit chip is attached to a carrier, an aqueous cleaning solution containing citric and oxalic acid based additives is applied to the carrier and attached integrated circuit chip. Then a deionized water rinse is applied to the carrier and attached integrated circuit chip, followed drying for a set time period. Next wirebonding on copper circuitization carried by the carrier is performed.

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patent: 4226640 (1980-10-01), Bertholdt
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patent: 4452643 (1984-06-01), Martin et al.
patent: 4800178 (1989-01-01), Mather et al.
patent: 5248525 (1993-09-01), Siebert
patent: 5331495 (1994-07-01), Yoshida et al.
JAPIO document, 91-285385, "Manufacture of Ceramic Electronic Circuit Board", PN JP03-285385, Dec. 16,1991.

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