Direct application of unpackaged integrated circuit to flexible

Details Direct application of unpackaged integrated circuit to flexible Direct application of unpackaged integrated circuit to flexible

1992-08-19

1993-11-16

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

2282481, H05K 334

Patent

active

052615936

ABSTRACT:
A method is described for electrically connecting flip chips to a flexible printed circuit substrate. The method comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad reflows to form an electrical connection with its corresponding solder bump.

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