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Cooling apparatus and method of fabrication thereof with a...

Metal fusion bonding – Process – Preplacing solid filler
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Copper-based brazing alloy and brazing process

Metal fusion bonding – Process – Preplacing solid filler
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Cream solder apparatus and printing method therefor

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Crevice corrosion-resistant liquid-cooled armature bar...

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Desoldering apparatus and method

Metal fusion bonding – Process – Preplacing solid filler
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Device and a method for applying a plurality of solder globules

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Die-bonding method of pellets

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Direct solder bumping of hard to solder substrate

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Electrically-isolated interconnects and seal rings in...

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Electronic substrate printing

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Electrostatic methods and apparatus for mounting and...

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Electrostatic methods and apparatus for mounting and...

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Enhanced mounting pads for printed circuit boards

Metal fusion bonding – Process – Preplacing solid filler
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Etched glass solder bump transfer for flip chip integrated circu

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Etched glass solder bump transfer for flip chip integrated...

Metal fusion bonding – Process – Preplacing solid filler
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Extremely rapid and economical method for welding pipes, elongat

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Filling device

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Filling device and method for filling balls in the apertures...

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Fine pitch solder application

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Fine pitch solder deposits on printed circuit board process and

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