Desoldering apparatus and method

Details Desoldering apparatus and method Desoldering apparatus and method

1985-01-11

1986-07-29

Ramsey, Kenneth J.

Metal fusion bonding

Process

Preplacing solid filler

219 85CM, 228 20, 228264, B23K 304, H05K 1304

Patent

active

046027335

ABSTRACT:
Apparatus for the selective removal of the solder and a connector soldered in the through hole of a circuit panel including means for heating the solder and a pair of aligned tubes placed against opposite surfaces of the panel surrounding the connecting through hole with the tubes being supplied with fluid under pressure so as to produce a pressure differential across the solder column in the through hole and effective to urge the connector and solder from the through hole into the low pressure tube when the solder is melted.

REFERENCES:
patent: 3045095 (1962-07-01), Usher et al.
patent: 3422247 (1969-01-01), Royston et al.
IBM Technical Disclosure Bulletin, vol. 25, No. 2, Jul. 1982, pp. 551-552.
IBM Technical Disclosure Bulletin, vol. 23, No. 9, Feb. 1981, pp. 4072-4073.

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