Electronic substrate printing

Details Electronic substrate printing Electronic substrate printing

2007-11-13

2007-11-13

Stoner, Kiley (Department: 1725)

Metal fusion bonding

Process

Preplacing solid filler

C427S096100

Reexamination Certificate

active

10346803

ABSTRACT:
A system for depositing solder paste on a print window of a printed circuit board through a stencil includes a housing providing a printing chamber, a depositor configured to move relative to the housing and to deposit the solder paste, a support device disposed in the printing chamber and configured to receive the circuit board and to selectively hold the circuit board stationary relative to the housing, a loading mechanism configured to receive the circuit board and to transport the circuit board along a second direction to the support device, a controller coupled and configured to control dispensing of the solder paste by the depositor and the transporting of the circuit board by the loading mechanism, and a rotational apparatus coupled to the support device and configured to rotate the support device, where the controller is configured to cause the rotational apparatus to rotate the support device more than about 10° and to cause the depositor to deposit solder paste onto the circuit board after the rotational device has rotated the support device more than about 10°.

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Patent Abstracts of Japan; JP 10089494 A (Tokyo Shibaura Electric Co.); Mar. 4, 1989; 1 pg.

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