Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate
2008-06-20
2010-06-08
Stoner, Kiley (Department: 1793)
Metal fusion bonding
Process
Preplacing solid filler
C228S254000, C438S122000
Reexamination Certificate
active
07731079
ABSTRACT:
A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.
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Campbell Levi A.
Chu Richard C.
Ellsworth, Jr. Michael J.
Furman Bruce K.
Iyengar Madhusudan K.
Heslin Rothenberg Farley & & Mesiti P.C.
International Business Machines - Corporation
Monteleone, Esq. Geraldine
Radigan, Esq. Kevin P.
Stoner Kiley
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