Metal fusion bonding – Process – Preplacing solid filler
Patent
1998-04-07
2000-05-09
Ryan, Patrick
Metal fusion bonding
Process
Preplacing solid filler
22818022, 228219, 228223, 2282341, 21912163, 21912165, B23K 3512, B23K 3102, B23K 120, B23K 2600
Patent
active
060591765
ABSTRACT:
A method for applying a plurality of solder globules to a substrate has a solder-globule fixing method, a plurality of glass fibers and a fibre holder. The solder-globule fixing method has provided therein a plurality of passages whose cross-sectional areas are smaller than the cross-sectional areas ofthe solder globules to be applied. The fibre holder is arranged relative to the solder-globule fixing device in such a way that between the fibre holder and the solder-globule fixing device a cavity is formed, which is adapted to be acted upon when submitted to pressure via a pressure-transmitting conduit. The fibre holder holds the glass fibres in alignment with the passages.
REFERENCES:
patent: 5445313 (1995-08-01), Boyd et al.
patent: 5565119 (1996-10-01), Behun et al.
patent: 5653381 (1997-08-01), Azdasht
patent: 5695667 (1997-12-01), Eguchi et al.
patent: 5768775 (1998-06-01), Nakazato
patent: 5834062 (1998-11-01), Johnson et al.
patent: 5899737 (1999-05-01), Trabucco
patent: 5909839 (1999-06-01), Belke, Jr. et al.
patent: 5977512 (1999-11-01), Azdasht et al.
Azadeh Ramin
Azdasht Ghassem
Lange Martin
Ruthnick Clemens
Pac Tech Packaging Technologies G.m.b.H.
Ryan Patrick
Stoner Kiley
LandOfFree
Device and a method for applying a plurality of solder globules does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Device and a method for applying a plurality of solder globules , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device and a method for applying a plurality of solder globules will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1056350