Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate
2005-03-29
2005-03-29
Dunn, Tom (Department: 1725)
Metal fusion bonding
Process
Preplacing solid filler
Reexamination Certificate
active
06871777
ABSTRACT:
Methods and associated apparatus are disclosed for use in mounting particles on and de-mounting particles from a substrate having an array of tacky and non-tacky areas. The particles can be either electrically conducting or electrically non-conducting. Selection of electrically conducting particles is preferred. The substrate having an array of tacky and non-tacky areas can either be electrically non-conducting (e.g., a dielectric substrate) or electrically-conducting. The methods involve use of first and second electrode plates with the substrate therebetween, the plates having applied thereto a direct current potential, which potential in preferred embodiments is reversed in polarity for a number N of cycles. Methods and articles are disclosed using an electrically conductive surface adjacent the tacky and non-tacky areas to minimize static buildup on the particles and tacky and non-tacky areas.
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Bednarz Thomas Kenneth
Cairncross Allan
Gantzhorn, Jr. John Edwin
Thomson, Jr. George Yeaman
Dunn Tom
Johnson Jonathan
Medlen & Carroll LLP
The Regents of the University of California
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