Etched glass solder bump transfer for flip chip integrated circu

Details Etched glass solder bump transfer for flip chip integrated circu Etched glass solder bump transfer for flip chip integrated circu

1998-02-05

2000-08-22

Ryan, Patrick

Metal fusion bonding

Process

Preplacing solid filler

228256, 257737, 438613, B23K 3512, H01L 244, H01L 2940

Patent

active

061058521

ABSTRACT:
A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the "flip chip" technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.

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"Brazing and Soldering Alloys", Brochure, Semi-Alloys Inc. MacQuesten Parkway, Mount Vernon, N.Y. 5 pages.

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