Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate
2007-07-17
2007-07-17
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Process
Preplacing solid filler
C228S124600, C257S678000, C438S106000
Reexamination Certificate
active
11174409
ABSTRACT:
Embodiments include electronic assemblies and methods for forming electronic assemblies. One embodiment includes a method of forming a MEMS device assembly, including forming an active MEMS region on a substrate. A plurality of bonding pads electrically coupled to the active MEMS region are formed. A seal ring wetting layer is also formed on the substrate, the seal ring wetting layer surrounding the active MEMS region. A single piece solder preform is positioned on the bonding pads and on the seal ring wetting layer, the single piece solder preform including a seal ring region and a bonding pad region. The seal ring region is connected to the bonding pad region by a plurality of solder bridges. The method also includes heating the single piece solder preform to a temperature above the reflow temperature, so that the bridges split and the solder from the preform accumulates on the seal ring wetting layer and the bonding pads. A lid is coupled to the solder. In certain embodiments the lid may include vias having conductive material therein for providing electrical contact to the MEMS device.
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Arana Leonel R.
Heck John
Beveridge Rachel E.
Intel Corporation
Johnson Jonathan
Konrad Raynes & Victor LLP
Raynes Alan S.
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