Structure of wafer level package with area bump
Structure to accommodate increase in volume expansion during...
Structure to improve adhesion between top CVD low-k...
Structure to increase density of MIM capacitors between...
Structure to monitor arcing in the processing steps of metal...
Structure to protect against below ground current injection
Structure to provide effective channel-stop in termination areas
Structure to provide junction breakdown stability for deep trenc
Structure to reduce line-line capacitance with low K material
Structure to reduce the on-resistance of power transistors
Structure to use an etch resistant liner on transistor gate...
Structure with a micro-electronic component made of a...
Structure with protruding source in split-gate flash
Structure with selective gap fill of submicron interconnects
Structure with selective gap fill of submicron interconnects
Structure, design structure and method of manufacturing dual...
Structure, material, and design for assembling a low-K Si...
Structure, material, and design for assembling a low-K Si...
Structure, materials, and applications of ball grid array...
Structure, method and system for assessing bonding of...