Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – With textured surface
Reexamination Certificate
2008-05-16
2010-10-19
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
With textured surface
C257SE23020, C257S737000, C257S781000, C257S786000, C438S613000
Reexamination Certificate
active
07816788
ABSTRACT:
Structures, methods, and systems for assessing bonding of electrodes in FCB packaging are disclosed. In one embodiment, a method comprises mounting a semiconductor chip with a plurality of first electrodes of a first shape to a mounted portion with a second electrode of a second shape, wherein the second shape is different from the first shape, bonding a respective on of the plurality of first electrodes and the second electrode using a first solder bump, generating an X-ray image of the first solder bump, and determining an acceptability of the bonding of the respective one of the plurality of first electrodes and the second electrode based on the X-ray image of the first solder bump.
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Kasai Junichi
Masuda Naomi
Tanaka Junji
Chu Chris
Spansion LLC
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