Backside-illuminated solid-state image pickup device
Ball grid array package construction with raised solder ball...
Bandgap tuned vertical color imager cell
Barrier region and method for wafer scale package (WCSP)...
Barrier regions for image sensors
Barrier regions for image sensors
Base of optoelectronic device
Bi-level multilayered microelectronic device package with an...
BiCMOS-integrated photodetecting semiconductor device having...
Bistable photoconductive switches particularly suited for freque
Bistable photoconductive switches particularly suited for freque
Bolometric detector with an antenna
Bond pad design
Bonded-wafer superjunction semiconductor device
Bonding of aluminum oxide components to silicons substrates
Bonding pad for low k dielectric
Bonding pad structure of semiconductor device and method for...
Bonding pads over input circuits
Borderless contact architecture
Boron carbide particle detectors