Barrier region and method for wafer scale package (WCSP)...

Details Barrier region and method for wafer scale package (WCSP)... Barrier region and method for wafer scale package (WCSP)...

2005-03-01

2005-03-01

Clark, S. V. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S437000

Reexamination Certificate

active

06861721

ABSTRACT:
A barrier region provided in the active surface of a wafer-level chip scale package device or chip (WCSP device or chip) to substantially reduce the amount of photon-generated substrate current that reaches active circuitry within the active area of the chip.

REFERENCES:
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patent: 4626884 (1986-12-01), Shannon
patent: 5485015 (1996-01-01), Choi
patent: 5650337 (1997-07-01), Cahen et al.
patent: 5767538 (1998-06-01), Mullins et al.
patent: 6538195 (2003-03-01), Shi et al.
patent: 20040119003 (2004-06-01), Ikeda

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