Filter, color filter array, method of manufacturing the...
Fingerprint detection device and method of its manufacture,...
Fingerprint sensor chip package method and the package...
Flexibility control in optical materials
Flexible circuit with two stiffeners for optical module...
Flexible photo-detectors
Flip chip on glass sensor package
Flip chip optical semiconductor on a PCB
Flip-chip image sensor packages and methods of fabrication
Focal plane arrays in type II-superlattices
Frame scale package using contact lines through the elements
Frame scale package using contact lines through the elements
Front illuminated back side contact thin wafer detectors
Front illuminated back side contact thin wafer detectors
Front side electrical contact for photodetector array and...
Front side illuminated photodiode with backside bump
Front side illuminated, back-side contact double-sided...
Front-illuminated-type photodiode array
Front-side illuminated, back-side contact double-sided...
Gallium nitride based III-V group compound semiconductor...