Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate
2011-07-12
2011-07-12
Such, Matthew W (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
C257SE21499, C257SE31119, C438S064000
Reexamination Certificate
active
07977759
ABSTRACT:
A fingerprint sensor chip package method and the package structure thereof are disclosed. The invention includes: providing a substrate; arranging a sensor chip on the substrate, with an active surface of the sensor chip facing upward; forming a patterned conductive colloid on the sensor chip, wherein the patterned conductive colloid extends from the periphery of the active surface of the sensor chip along the side wall of the sensor and electrically connects with the circuit layer of the substrate; forming a non-conductive film to cover the sensor chip, the patterned conductive colloid and a portion of the substrate; and forming a conductive film on the non-conductive film. The patterned conductive colloid replaces the conventional bond wires to improve the product yield and to omit the molding process. The conductive film is electrically connected with the grounding point/area on the substrate to dissipate the static charges for protecting the chip.
REFERENCES:
patent: 2004/0104458 (2004-06-01), Tsukada et al.
Harrison Monica D
Rosenberg , Klein & Lee
Such Matthew W
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