Frame scale package using contact lines through the elements

Details Frame scale package using contact lines through the elements Frame scale package using contact lines through the elements

2006-03-14

2006-03-14

Zarneke, David A. (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S434000

Reexamination Certificate

active

07012315

ABSTRACT:
A package for an integrated circuit contacting device which is shaped like a frame. A portion of the contacting device may be bonded to the printed circuit board, and includes leads which extend along in outer surface thereof, from an outside edge of the package to a downward facing surface of the package which faces an integrated circuit die. The package may be in dented in the shape of the die, and may also include indentations allowing a lid and/or a back portion to be located thereon. In an embodiment, a lens amounts may also be used.

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