Backside bus vias
Backside connection to TSVs having redistribution lines
Backside metallization on sides of microelectronic dice for...
Bond pad connection to redistribution lines having tapered...
Bond pad for low K dielectric materials and method for...
Buffer grated structure for metrology mark and method for...
Building metal pillars in a chip for structure support
Bulk substrates in FinFETs with trench insulation...
Buried conductor patterns formed by surface transformation...
Buried conductors
Buried contact architecture