Tape automated bonding method and bonded structure
Tape circuit substrate and semiconductor chip package using...
Teardrop shaped lead frames
Technique for improving bonding strength of leadframe to substra
Thermally enhanced component interposer: finger and net...
Thermally enhanced lead-under-paddle I.C. leadframe
Thermoplastic resin composition for semiconductor, adhesion...
Thin, thermally enhanced flip chip in a leaded molded package
Transverse hybrid LOC package
Transverse hybrid LOC package
Twin transistor device with improved collector-base isolation