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Semiconductor package including leads and conductive posts...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Semiconductor-supporting devices, processes for the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Sensor module and method for manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Silicon heat spreader mounted in-plane with a heat source...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Silicon package for piezoelectric device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Stacked structures and methods of fabricating stacked...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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System of a package fabricated on a semiconductor or...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Systems for buried electrical feedthroughs in a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Thin film circuit board device and its manufacturing method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Thin leadless plastic chip carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Three dimensional device integration method and integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Three-dimensional multichip packages and methods of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Patent

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Unitary silicon die module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Patent

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Using adhesive materials as insulation coatings for leadless...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Voltage contrast monitor for integrated circuit defects

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Wafer level chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Wafer level package for micro device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Wafer level package with die receiving through-hole and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Warp-resistant ultra-thin integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Patent

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Window-type semiconductor package and fabrication method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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