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Selected: P

Package and method for assembly of infra-red imaging devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Patent

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Package for a high-frequency electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Packaged semiconductor device having bent leads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Packaging system for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Packed semiconductor device with wrap around external leads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Patent

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Plastic integrated circuit device package and leadframe...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Plastic integrated circuit device package and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Press-fit diode for universal mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Press-fit semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Patent

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Process for manufacturing semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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