LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With semiconductor element forming part

Selected: L

M N O P Q R S T U V W X Y Z 0 1 2 3 4 5 6 7 8 9 ! " $ ' ( ) * , - / : < = > ? @ [ \ ] ^ ` { | } ~ €

Laminar multi-layer piezoelectric roll component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Lead frame design for burr-free singulation of molded array...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Lead-bond type chip package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Lead-bond type chip package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Leadframe for use in manufacturing a resin-molded...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Leadless leadframe package design that provides a greater...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Leadless microelectronic package and a method to maximize...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Low profile semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Low-pin-count chip package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Low-pin-count chip package having concave die pad and/or...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

Charities
Companies
MP Candidates
Patents
Employee Salary Disclosure

World

Places of the World
Scientific Papers

United States

Banks
Companies
Counties
Patents
Employee Salary Disclosure