High performance chip scale leadframe package with thermal...
High performance chip scale leadframe package with thermal...
Housing for receiving a planar power transistor
IC chip mounting structure and display device
IC chip package
IC package with integral substrate capacitor
Integrated circuit device with exposed upper and lower die...
Integrated circuit package with exposed die surfaces and...
Integrated circuit packaging system with package stacking...
Integrated device package and fabrication methods thereof
Integrated passivation process, probe geometry and probing...
Invertible microfeature device packages
Laminar multi-layer piezoelectric roll component
Lead frame design for burr-free singulation of molded array...
Lead-bond type chip package and manufacturing method thereof
Lead-bond type chip package and manufacturing method thereof
Leadframe for use in manufacturing a resin-molded...
Leadless leadframe package design that provides a greater...
Leadless microelectronic package and a method to maximize...
Low profile semiconductor package