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High performance chip scale leadframe package with thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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High performance chip scale leadframe package with thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Housing for receiving a planar power transistor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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IC chip mounting structure and display device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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IC chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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IC package with integral substrate capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Integrated circuit device with exposed upper and lower die...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Integrated circuit package with exposed die surfaces and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Integrated circuit packaging system with package stacking...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Integrated device package and fabrication methods thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Integrated passivation process, probe geometry and probing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Invertible microfeature device packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Laminar multi-layer piezoelectric roll component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Lead frame design for burr-free singulation of molded array...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Lead-bond type chip package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Lead-bond type chip package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Leadframe for use in manufacturing a resin-molded...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Leadless leadframe package design that provides a greater...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Leadless microelectronic package and a method to maximize...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Low profile semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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