Integrated circuit packaging system with package stacking...

Details Integrated circuit packaging system with package stacking... Integrated circuit packaging system with package stacking...

2009-03-26

2010-12-07

Fourson, George (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257S698000, C257S778000, C257SE21512, C257SE23011, C257SE23126, C257SE21614, C257SE25027

Reexamination Certificate

active

07847382

ABSTRACT:
A method of manufacture of an integrated circuit packaging system includes: forming an encapsulation surrounding an integrated circuit having an inactive side and an active side exposed; forming a hole through the encapsulation with the hole not exposing the integrated circuit; forming a through conductor in the hole; and mounting a substrate with the integrated circuit surrounded by the encapsulation with the active side facing the substrate.

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