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Interposer configured to reduce the profiles of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Interposer containing bypass capacitors for reducing voltage...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Interposer for impedance matching

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Interposer stacking system and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Interposer stacking system and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Interposer, semiconductor chip mounted sub-board, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Interposers for chip-scale packages and intermediates thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Interposers for chip-scale packages and intermediates thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Inverted CSP stacking system and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Invertible microfeature device packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Isolated stacked die semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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