Isolated stacked die semiconductor packages

Details Isolated stacked die semiconductor packages Isolated stacked die semiconductor packages

2010-11-18

2011-11-08

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S735000

Reexamination Certificate

active

08053883

ABSTRACT:
Semiconductor packages that contain isolated, stacked dies and methods for making such devices are described. The semiconductor package contains both a first die with a first integrated circuit and a second die with a second integrated circuit that is stacked onto the first die while also being isolated from the first die. The first and second dies are connected using an array of metal connectors containing both a base segment and a beam segment extending over the first die and supporting the second die. This configuration can provide a thinner semiconductor package since wire-bonding is not used. As well, since the integrated circuit devices in the first and second dies are isolated from each other, local heating and/or hot spots are diminished or prevented in the semiconductor package. Other embodiments are also described.

REFERENCES:
patent: 5399898 (1995-03-01), Rostoker
patent: 6369446 (2002-04-01), Tanaka
patent: 6369448 (2002-04-01), McCormick
patent: 6407456 (2002-06-01), Ball
patent: 6781849 (2004-08-01), Baek et al.
patent: 6867500 (2005-03-01), Corisis et al.
patent: 7145223 (2006-12-01), Kunimatsu et al.
patent: 7180165 (2007-02-01), Ellsberry et al.
patent: 7180166 (2007-02-01), Ho et al.
patent: 7253026 (2007-08-01), Ahn et al.
patent: 7262506 (2007-08-01), Mess et al.

Affiliated with

Also associated with

Rating

Isolated stacked die semiconductor packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Isolated stacked die semiconductor packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Isolated stacked die semiconductor packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4295407