4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material
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Semiconductor package having heat spreader and package stack...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package having interlocking heat sinks and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Semiconductor package having step type die and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package having thermal interface material (TIM)

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package structure having enhanced thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package which has no resinous flash formed on...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package with exposed heat sink and the heat...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package with ground projections

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package with heat dissipating structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package with heat dissipating structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reissue Patent

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Semiconductor package with heat dissipating structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package with heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package with heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package with heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package with heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package with heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package with heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package with integrated heat spreader attached...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package with lid heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package with low strain seal

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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