Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-02-15
2005-02-15
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S704000, C257S705000, C257S730000, C257S731000, C257S783000
Reexamination Certificate
active
06856015
ABSTRACT:
A semiconductor package includes a substrate having a top surface and a bottom surface; at least one chip mounted on the top surface of the substrate and electrically connected to the substrate; a heat sink attached to the top surface of the substrate by an adhesive material applied therebetween; and a plurality of solder balls implanted on the bottom surface of the substrate. The heat sink has a flat portion and a support portion connected to the flat portion. The support portion has at least one recess portion facing toward the top surface of the substrate and at least one burr formed on an interior surface of the recess portion such that the adhesive material can fill the recess portion and submerge the burr to provide an anchoring effect to firmly secure the heat sink in position on the substrate.
REFERENCES:
patent: 5311402 (1994-05-01), Kobayashi et al.
patent: 5369403 (1994-11-01), Temes et al.
patent: 5637920 (1997-06-01), Loo
patent: 5889323 (1999-03-01), Tachibana
patent: 5926371 (1999-07-01), Dolbear
patent: 5931222 (1999-08-01), Toy et al.
patent: 6011304 (2000-01-01), Mertol
patent: 6093961 (2000-07-01), McCullough
patent: 6282096 (2001-08-01), Lo et al.
patent: 6441485 (2002-08-01), Glenn
patent: 6509636 (2003-01-01), Tsai et al.
patent: 6552266 (2003-04-01), Carden et al.
patent: 6747346 (2004-06-01), Saito et al.
patent: 1-161736 (1989-06-01), None
patent: 2-58354 (1990-02-01), None
patent: 3-105950 (1991-05-01), None
Chiu Shih-Kuang
Hsiao Cheng-Hsu
Huang Chien-Ping
Clark Jasmine
Corless Peter F.
Edwards & Angell LLP
Jensen Steven M.
Siliconware Precision Industries Co. Ltd.
LandOfFree
Semiconductor package with heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package with heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package with heat sink will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3463676