Semiconductor package with heat sink

Details Semiconductor package with heat sink Semiconductor package with heat sink

2003-06-16

2008-11-04

Nguyen, Thanh (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S718000, C257S720000, C257S796000, C257SE23080

Reexamination Certificate

active

07446408

ABSTRACT:
A package is provided for a semiconductor device including a semiconductor device support substrate having at least one interconnect metal therein connectible to a ground and having at least one opening exposing the surface of the interconnect metal. A heat sink has elastic means integral therewith for cooperating with the opening to position and secure the heat sink to the semiconductor support substrate.

REFERENCES:
patent: 3955122 (1976-05-01), Maynard et al.
patent: 5641987 (1997-06-01), Lee
patent: 5834839 (1998-11-01), Mertol
patent: 5872395 (1999-02-01), Fujimoto
patent: 5977626 (1999-11-01), Wang et al.
patent: 6008991 (1999-12-01), Hawthorne et al.
patent: 6188578 (2001-02-01), Lin et al.
patent: 6201301 (2001-03-01), Hoang
patent: 6329603 (2001-12-01), Japp et al.
patent: 6528876 (2003-03-01), Huang
patent: 6559536 (2003-05-01), Katoh et al.

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