Semiconductor package with integrated heat spreader attached...

Details Semiconductor package with integrated heat spreader attached... Semiconductor package with integrated heat spreader attached...

2006-05-09

2006-05-09

Owens, Douglas W (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S675000

Reexamination Certificate

active

07042084

ABSTRACT:
A semiconductor package substrate has top and bottom surface buildup layers disposed on a thermally conductive substrate core. A portion of the substrate core may be exposed at a top surface of the package substrate to allow a heat spreader to be thermally coupled to the substrate core. An integrated circuit may be mounted on a top surface of the package substrate, with a top surface of the integrated circuit facing down. A heat spreader may be attached to the package substrate. The heat spreader may be thermally coupled to the substrate core and to a backside surface of the integrated circuit.

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Ravi Mahajan et al.; The Evolution of Microprocessor Packaging; Intel Technology Journal Q3, 2000; pp. 1-10.

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