LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Combined with electrical contact or lead

Selected: T

All A B C D E F G H I J K L M N O P Q R S

U V W X Y Z 0 1 2 3 4 5 6 7 8 9 ! " $ ' ( ) * , - / : < = > ? @ [ \ ] ^ ` { | } ~ €

Thru silicon enabled die stacking scheme

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Ti liner for copper interconnect with low-k dielectric

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Tin palladium activation with maximized nuclei density and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Tin-bismuth (Sn-Bi) family alloy solder and semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Tiny ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

TiSi.sub.2 /TiN clad interconnect technology

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Titanium nitride diffusion barrier for use in non-silicon...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Titanium nitride films

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Titanium nitride/titanium silicide multiple layer barrier with p

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Titanium/aluminum/nitrogen material for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Top and sidewall bridged interconnect structure and method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Top and sidewall bridged interconnect structure and method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0