LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Combined with electrical contact or lead

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RFID-chip having RFID-tag or magnifying electrode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Ring positionable about a periphery of a contact pad,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Robust interlocking via

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Robust via structure and method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Rolling ball connector

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Room temperature metal direct bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Roughened bonding pad and bonding wire surfaces for low...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – With textured surface

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Routable high-density interfaces for integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Routing density enhancement for semiconductor BGA packages and p

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Patent

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Routing design to minimize electromigration damage to solder...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Routing differential signal lines in a substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Routing scheme for differential pairs in flip chip substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Routing vias in a substrate from bypass capacitor pads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

RuSixOy-containing adhesion layers and process for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

RuSixOy-containing barrier layers for high-k dielectrics

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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