4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With heat sink embedded in encapsulant
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American Electronic Components

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Arikawa Tadashi

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Beyer Weaver LLC

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ChipPAC, Inc.

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Hackitt Dale

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Ichida Akira

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International Packaging and Assembly Corporation

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Kabushiki Kaisha Gotoh Seisakusho

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Kim Sun Dong

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Komatsu Katsuji

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Kuramoto Syunichi

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Lee Jung-Yu

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Lee Kuo-Yuan

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Lee Taekeun

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Lee Teck Sim

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Matae Youichi

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Mimura Seiichi

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Nishida Sadahito

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O'Donley Bobby

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Ookura Yasushi

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