4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With heat sink embedded in encapsulant

Tadashi Arikawa

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Composite material, method for producing same and member...

Alloys or metallic compositions – Molybdenum base
Reexamination Certificate

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Heat sink substrate consisting essentially of copper and...

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Post sintering operation
Reexamination Certificate

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Heat sink substrate consisting essentially of copper and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Method of producing a heat dissipation substrate of...

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Powder shape or size characteristics
Reexamination Certificate

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Plastic-packaged semiconductor device having a heat sink matched

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Profile ID: LFUS-PAI-P-1414659

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