Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With heat sink embedded in encapsulant
Inventor
active
Fabrication method for semiconductor package substrate and semic
Lead frame and bottom lead semiconductor package using the...
Lead frame and semiconductor package
Lead frame having supporters and semiconductor package using sam
Plate and column type semiconductor package having heat sink
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Profile ID: LFUS-PAI-P-652414