4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With heat sink embedded in encapsulant

Teck Sim Lee

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Package for electronic device

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Connector – conductor or housing therefor
Design Patent

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Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate

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Semiconductor package with mold lock vent

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3266775

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