4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With heat sink embedded in encapsulant

Akira Ichida

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Heat sink substrate consisting essentially of copper and...

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Post sintering operation
Reexamination Certificate

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Heat sink substrate consisting essentially of copper and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Plasma facing components of nuclear fusion reactors...

Coating processes – Direct application of electrical – magnetic – wave – or... – Chemical vapor deposition
Reexamination Certificate

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Plasma facing components of nuclear fusion reactors...

Coating processes – Direct application of electrical – magnetic – wave – or... – Chemical vapor deposition
Reexamination Certificate

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Plastic-packaged semiconductor device having a heat sink matched

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Profile ID: LFUS-PAI-P-1414660

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