4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With heat sink embedded in encapsulant

Dale Hackitt

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active

Bottom heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Microelectronic package having a stiffening element and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Microelectronic package having a stiffening element and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Slotted thermal dissipater for a semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Use of direct gold surface finish on a copper wire-bond...

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1883326

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