4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With heat sink embedded in encapsulant

ChipPAC, Inc.

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Bump-on-lead flip chip interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate

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Chip scale package with flip chip interconnect

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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DBG system and method with adhesive layer severing

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate

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DBG system and method with adhesive layer severing

Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate

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DBG system and method with adhesive layer severing

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate

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