Molded electrical device
Molded lead frame dual in line package including a hybrid circui
Molded semiconductor package having improved heat dissipation
Molded-in isolation bushing for semiconductor devices
Mounting for locking disc shaped semiconductor element in a hous
Mounting pad and semiconductor encapsulation device combination
Multi-level circuits, methods for their fabrication, and display
Multichip thin film module
Multifiber optical cable connector
Multifunction ground plane
Multilayer ceramic package with high frequency connections
Multiple connection for an undersea cable system
Multiple fiber laminate for optical waveguides
Multiple layer lead frame
Multiple lead seal assembly for a liquid-metal-cooled fast-breed