Molded semiconductor package having improved heat dissipation

Details Molded semiconductor package having improved heat dissipation Molded semiconductor package having improved heat dissipation

1985-12-16

1987-08-04

Rutledge, L. Dewayne

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 357 81, 174 52FP, H01L 2336

Patent

active

046849750

ABSTRACT:
An improved metal tape for tape automated bonding provides for enhanced heat dissipation from the packaged semiconductor device. The invention includes two aspects. In the first aspect, individual metal tape leads are extended inward beyond the peripheral bonding pads of the semiconductor and over the active region of the semiconductor device. In this way, the leads are able to conduct heat away from the active region of the device. The second aspect of the invention relates to improved heat dissipation through the individual leads. The leads are flared or otherwise increased in area in the direction away from the active region of the semiconductor device to prove the radiative dissipation.

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