Molded lead frame dual in line package including a hybrid circui

Details Molded lead frame dual in line package including a hybrid circui Molded lead frame dual in line package including a hybrid circui

1979-08-30

1981-12-01

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 357 75, 357 80, 357 73, 174 52FP, H01L 2302, H01L 2312, H01L 2316

Patent

active

043039340

ABSTRACT:
A molded dual in line package is disclosed which has at least one cavity in a first major molded surface thereof into which an integrated circuit chip can be mounted and wire bonded. After the circuit is tested and adjusted, the cavity is sealed with a metal plate. Other embodiments are disclosed which include a second cavity in a second major molded surface of the package which may house or contain a second integrated circuit, an epoxy sealer, or a substrate.

REFERENCES:
patent: 3535486 (1970-10-01), Wood
patent: 3585272 (1971-06-01), Shatz
patent: 3659035 (1972-04-01), Pianzo
patent: 3768157 (1973-10-01), Buie
patent: 4079511 (1978-03-01), Grabbe
patent: 4105861 (1978-08-01), Hascoe
patent: 4163072 (1979-07-01), Soos
patent: 4195193 (1980-03-01), Grabbe
patent: 4208698 (1980-06-01), Narasimhan

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