Molded-in isolation bushing for semiconductor devices

Details Molded-in isolation bushing for semiconductor devices Molded-in isolation bushing for semiconductor devices

1982-06-03

1984-07-17

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 79, 357 80, 357 74, 174 16HS, 174153G, H01L 2332, H01L 2308, H01L 2330

Patent

active

044609175

ABSTRACT:
An improved molded-in insulated bushing is provided to electrically isolate the mounting fastener used to attach the metallic heat spreader of a semiconductor power device to an external heat sink. The bushing has at one end a flange protruding from one surface of the heat spreader and of sufficient height to exceed the required flash-over voltage. The other end fills a chamfered portion of the heat spreader, and is flush with or relieved from the heat spreader surface which contacts the external heat sink. This shape increases the surface flash-over distance and voltage above that of bushings of the prior art and retains the bushing in the heat spreader. The bushing is advantageously formed during molding of the plastic device encapsulation, but is separated from the encapsulation so that mounting forces are not transmitted through the encapsulation to the semiconductor die and lead wires.

REFERENCES:
patent: 3369597 (1968-02-01), Dronsuth et al.
patent: 3514529 (1970-05-01), Keto
patent: 3728584 (1973-04-01), Kuhlow
patent: 3801874 (1974-04-01), Stefani
patent: 4068368 (1978-01-01), Debard et al.
patent: 4259685 (1981-03-01), Romano
"Expanding Bushing"-Hufford-Western Electric Technical Digest No. 3, Jul. 1966, pp. 39-40.

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