Multiple layer lead frame

Details Multiple layer lead frame Multiple layer lead frame

1989-12-27

1991-05-07

Hille, Rolf

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 524, H01L 2348, H01L 2354

Patent

active

050141139

ABSTRACT:
A lead frame having multiple layers permits fine connection to a large number of bonding pads on an electronic component such as an integrated circuit (IC), but strong external package leads. A fully featured or completely extensive lead frame layer bears proximal ends that may be finely dimensioned for connection with the bonding pads of an IC. A second frame layer is laminated with the first layer, but does not have proximal ends that extend as far as those of the fully featured frame layer. The doubled external leads for mounting to a printed circuit board (PCB) are relatively stronger than the single, more finely featured proximal lead ends that are bonded to the component. The lead frame layers may also differ with respect to their thicknesses, electrical conductivity, strength and solder-wetting characteristics.

REFERENCES:
patent: 3627901 (1971-12-01), Happ
patent: 4496965 (1985-01-01), Orcutt et al.

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